Shin-Etsu die attach materials come in two types : epoxy and silicone type. Epoxy based B stage material is a high purity insulating die attach material developed for stencil or screen printing. It has excellent releasability, shape retention, storage stability at B stage status(semi-cured status with no tack appearance). After chip bonding, it can be re-melted by heating at high temperature and treated like thermal curing. It shows very low stress after curing.